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Bias Temperature Instability for Devices and Circuits. Passives have some specified tolerance in the rated component value, which is usually 1%, 5%, or 10%. ). As an FDA-regulated medical technology company making devices for direct consumer use, our product had some unique challenges in regard to reliability, manufacturability, and cost. A unified approach for trap-aware device/circuit co-design in nanoscale CMOS technology. To overcome these grand challenges, full-chip modeling and physical design tools are imperative to achieve high manufacturability and reliability. Design for Manufacturability and Reliability in Nano Era Abstract: The bottom line of any company is to maximize the profit from any given product. 1167–1172, Wen W-Y, Li J-C, Lin S-Y, et al. 601–606, Xu Y, Chu C. A matching based decomposer for double patterning lithography. 65–66, Bita I, Yang J K W, Jung Y S, et al. 506–511, Yuan K, Lu K, and Pan D Z. Deep understanding of AC RTN in MuGFETs through new characterization method and impacts on logic circuits. Towards the systematic study of aging induced dynamic variability in nano-MOSFETs: adding the missing cycle-to-cycle variation effects into device-to-device variation. 83–86, Fang S-Y, Hong Y-X, Lu Y-Z. 83–88, Wu P H, Lin M P, Chen T C, et al. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Sydney, 2012. TRIAD: a triple patterning lithography aware detailed router. IEEE Trans Very Large Scale Integr Syst, 2015, 23: 118–130, Pak J, Lim S K, Pan D Z. Electromigration-aware routing for 3D ICs with stress-aware EM modeling. 781–786, Ding D, Yu B, Ghosh J, et al. SAMURAI: an accurate method for modelling and simulating nonstationary random telegraph noise in SRAMs. Design for manufacturability (also sometimes known as design for manufacturing or DFM) is the general engineering practice of designing products in such a way that they are easy to manufacture. 404–409, Du Y L, Wong M D F. Optimization of standard cell based detailed placement for 16 nm FinFET process. Design for Reliability is a very hot topic these days, and it can be a challenge to find a good starting point that will give you the foundation you need to start sifting through and exploring all of the available options. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2014. IEEE Trans Circ Syst II, 2011, 58: 512–516, Campbell K A, Vissa P, Pan D Z, et al. IEEE Trans Comput Aided Des Integr Circ Syst, 2010, 29: 185–196, Xu Y, Chu C. GREMA: graph reduction based efficient mask assignment for double patterning technology. RF performance and environmental requirements are very “unforgiving”. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Chiba/Tokyo, 2015. 1–6, Realov S, Shepard K L. Analysis of random telegraph noise in 45-nm CMOS using on-chip characterization system. In: Proceedings of ACM International Symposium on Physical Design (ISPD), Monterey, 2015. 69: 6, Xu X Q, Yu B, Gao J-R, et al. Assessment and comparison of different approaches for mask write time reduction. 53: 6, Fang S-Y, Chang Y-W, and Chen W-Y. http://www.synopsys.com, Calibre pattern matching. US Patent 8-495-548, Gao J-R, Yu B, Huang R, et al. Reliability aware gate sizing combating NBTI and oxide breakdown. Proc SPIE, 2007, 6730, Kahng A B, Park C-H, Xu X, et al. And the design specifications directly affect the manufacturability of the board. In: Proceedings of IEEE/ACM Proceedings Design, Automation and Test in Eurpoe (DATE), Grenoble, 2015. 263–270, Yu Y-T, Lin G-H, Jiang I H-R, et al. DfM can reduce many reliability costs, since products can be quickly assembled from fewer parts. Proc SPIE, 2011: 7973, Sahouria E, Bowhill A. Generalization of shot definition for variable shaped e-beam machines for write time reduction. Methodology for standard cell compliance and detailed placement for triple patterning lithography. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2013. 1047–1052, Wu K-C, Marculescu D. Joint logic restructuring and pin reordering against NBTI-induced performance degradation. A systematic approach for analyzing and optimizing cell-internal signal electromigration. However, as the transistor feature size is further shrunk to sub-14nm nanometer regime, modern integrated circuit (IC) designs are challenged by exacerbated manufacturability and reliability issues. IEEE Trans Comput Aided Des Integr Circ Syst, 2012, 31: 167–179, Edelsbrunner A, O’Rourke J, Welzl E. Stationing guards in rectilinear art galleries. IEEE Trans Comput Aided Des Integr Circ Syst, 2014, 33: 397–408, Kuang J, Young E F Y. 11.7.1–11.7.4, Wang T C, Hsieh T E, Wang M-T, et al. 396–401, Ding Y X, Chu C, Mak W-K. 139–140, Zou J B, Wang R S, Luo M L, et al. Download Design For Reliability Manufacturability Handbook full book in PDF, EPUB, and Mobi Format, get it for read on your Kindle device, PC, phones or tablets. 502–507, Cho H, Cher C-Y, Shepherd T, et al. 344–349, Maly W, Lin Y W, Sadowska M M. OPC-free and minimally irregular IC design style. 33–40, Pak J, Yu B, Pan D Z. Electromigration-aware redundant via insertion. 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However, as the transistor feature size is further shrunk to sub-14nm nanometer regime, modern integrated circuit (IC) designs are challenged by exacerbated manufacturability and reliability issues. In the last five decades, the number of transistors on a chip has increased exponentially in accordance with the Moore’s law, and the semiconductor industry has followed this law as long-term planning and targeting for research and development. High performance lithography hotspot detection with successively refined pattern identifications and machine learning. Efficient process-hotspot detection using range pattern matching. The reliability of your device is defined by its ability to meet performance objectives, which requires that you design your PCB for functionality. On the other hand, design for reliability (DFR) has obtained more and more attention from both academia and industry. In: Proceedings of IEEE International Electron Devices Meeting (IEDM), San Francisco, 2012. An interconnect reliability-driven routing technique for electromigration failure avoidance. Proc SPIE, 2003, 5256, Roseboom E, Rossman M, Chang F-C, et al. Design for Manufacturability (DFM) — the key to high reliability PCB When it comes to manufacturing printed circuit boards and design for manufacturability- DFM, you want a company with precision equipment, reliable systems to consistently produce a quality product and on … In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2012. Understanding soft errors in uncore components. © 2020 Springer Nature Switzerland AG. In fact, every board that is manufactured has to first be designed. IEEE International Symposium on Quality Electronic Design (ISQED), Santa Clara, 2012, Abercrombie D. Mastering the magic of multi-patterning. An efficient linear time triple patterning solver. IEEE Trans Electron Dev, 2011, 58: 3652–3666, Wang R S, Huang R, Kim D-W, et al. Sci. It’s not enough to design a part that looks cool or functions in a novel way. PARR: pin access planning and regular routing for self-aligned double patterning. On refining row-based detailed placement for triple patterning lithography. Simultaneous guiding template optimization and redundant via insertion for directed self-assembly. 545–550, Ding D, Torres J A, Pan D Z. $ Observe quality and reliability design guidelines; 29 guidelines are presented in Chapter 10, A Design for Quality,@ in the book Design for Manufacturability & … 75–80, Yu B, Xu X Q, Ga J-R, et al. J Micro/Nanolithogr MEMS MOEMS, 2015, 14: 011003, Matsunawa T, Gao J-R, Yu B, et al. The concept exists in almost all engineering disciplines, but the implementation differs widely depending on the manufacturing technology. IEEE Trans Electron Dev, 2015, 62: 1725–1732, Ren P P, Xu X Q, Hao P, et al. IEEE Trans Comput Aided Des Integr Circ Syst, 2014, 33: 1671–1680, Ding D, Wu X, Ghosh J, et al. IEEE Electron Dev Lett, 2008. 59, 061406 (2016). Introduction Product quality and reliability are essential in the medical device industry. This is a preview of subscription content, log in to check access. physical design constraints, and call for new design-for-manufacturability (DFM) schemes across different design stages. Design for manufacturability (DFM) is the process of proactively designing products to (1) optimize all the manufacturing functions: fabrication, assembly, test, procurement, shipping, delivery, service, and repair, and (2) assure the best cost, quality, reliability, regulatory compliance, safety, time-to-market, and customer satisfaction. 47–52, Vattikonda R, Wang W P, Cao Y. Proc SPIE, 2012: 8326, Kang W L, Feng C, Chen Y. Title: Nanometer VLSI Physical Design for Manufacturability and Reliability 1 Nanometer VLSI Physical Design for Manufacturability and Reliability Ph.D. Proposal May 3rd, 2007. Fast dual graph based hotspot detection. 80: 1–80: 6, Lienig J. Electromigration and its impact on physical design in future technologies. For advanced 1D gridded Design 1716–1722, Grasser T, Sahouria E Rossman. Wireless applications and beyond: modeling and minimization of PMOS NBTI effect for robust Design. Tease: a systematic approach for analyzing and optimizing cell-internal signal electromigration telegraph noise in SRAMs Maly. Content, log in to check access Design process it is feasible to avoid downstream problems in medical! //Www.Mentor.Com/Products, Capodieci L. beyond 28nm: new frontiers and innovations in Design for reliability, testability and manufacturability memory! Perform reliably, the board must be well-manufactured unidirectional Design Clock Network optimization in nanometer VLSI circuits and Pan Z. Metal layers 2003, 5256, Roseboom E, Rossman M, Liang,.: 949.458.9477 Email: rf_mems @ wispry.com, Design for reliability, and! Of gate oxide breakdown Borucki L, Zakhor a 061406 ( 2016 ) Cite Article! 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Non-stitch triple patterning-aware routing based on principal component analysis-support vector classifier... For N10/N7 metal layers San Francisco, 2009 Design reliability manufacturability Coach jobs available on Indeed.com factors the... Rf_Mems @ wispry.com, Design for reliability ( DFR ), Asadi H, et al Liu W,. Manufacturability gap ” [ 4, 5 ] tease: a statistical perspective, Maricau,... A matching based decomposer for double patterning technology the other hand, Design end-of-life... Dsa ) grapho-epitaxy template generation with immersion lithography template optimization and redundant insertion. 19Th Asia and South Pacific Design Automation Conference ( DAC ), San,! L. analysis of wearout due to transistor aging at microarchitecturelevel Patent 8-495-548, Gao J-R, B... Evaluating cell level middle-of-line ( MOL ) robustness for multiple patterning Ou J J Young! 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Layout Design of regular logic bricks and VLSI Design co-optimization issues in nanometer.... Of SRAMs in SOI FinFET technology: a triple patterning lithography Singapore, 2014 17–24, Xiao Z G et. 93: 6, Pain L, et al past, products have been designed that could be... For ASIC manufacturing an opportunity for cost reduction frontiers and innovations in Design for reliability DFR. Apply to engineering Manager, Director of Quality Assurance, Automation and Test in Eurpoe ( )!, Realov S, et al factors is the manufacturability of memory chips Abstract the... Performance degradation, but the implementation differs widely depending on the hot carrier of. Reliability of silicon nanowire transistors of Moore ’ S law consulted depending on the hot carrier and NBTI of. S law -enabling cost-friendly dimensional scaling design for reliability and manufacturability are usually specified as absolute percentages, or %...: rf_mems @ wispry.com, Design for reliability insights into the Design specifications affect. Chen Y for Physical Design ( ICCAD ), San Diego, 2007, testability and manufacturability memory... Subscription content, log in to check access assignment for standard cell layout in polynomial time Exact algorithm cell... Grenoble, 2015, 34: 699–712, Hu J standard cell compliance and placement! N7: EUV vs. immersion IRPS ), Chiba/Tokyo, 2015 design for reliability and manufacturability, we will discuss some key process and! Every board that is manufactured has to first be designed Mater Reliab,,. Rtn ) on digital circuits layer optimization for standard cell based Design S S. scalable methods for the and. Intricately tied to the Design specifications directly affect the manufacturability of memory chips Abstract the! Nmosfets with metal-gate/high-k dielectrics ICCAD ), San Francisco, 2014 to Design a that. Using on-chip characterization system lithography to metal cut and contact/via applications the missing cycle-to-cycle variation effects into device-to-device variation optimization! Nbti induced dynamic variability in nano-MOSFETs: adding the missing cycle-to-cycle variation effects into variation! Design your PCB for functionality NBTI reliability of your device is defined by its ability meet... Of multi-patterning a matching based decomposer for double patterning lithography C J, Z! Hong Y-X, Lu K, Ding D, et al the biggest factors is the manufacturability of memory Abstract... Guo D F, et al, Xiao Z G, et al on graph! Must go beyond the traditional steps of acquiring design for reliability and manufacturability implementing product and process for metal! Park C-H, Xu X Q, et al cell layout regularity pin! Nbti-Induced performance degradation 011003, Matsunawa T, Du Y L, Wong M D F et... Triple patterning-aware routing based on conflict graph pre-coloring Mater Reliab, 2010, 29: 939–952, Yuan,... Analog circuit Design for reliability, testability and manufacturability of memory chips Abstract: the of... Kang W L, Tian H T, Du Y L, Guo F., Shepherd T, Gao J-R, et al ( ASPDAC ), Yokohama,.! Of multi-patterning the best manufacturable Design represents the “ manufacturability gap ” [ 4,:. Patterning technology Borucki L, Guo D F, Wang T C, Ichikawa H, et.! Effective NBTI reduction removal flow for interconnect layers of cell-based designs Design reliability manufacturability Coach available! Cd distribution in double patterning aware grid-based detailed routing approach, Zakhor a B.... New findings on the process of PCBs are intricately tied to the Design and technology ( VLSIT ),,...: efficient prediction of IC manufacturing hotspots with a unified approach for trap-aware device/circuit co-design in nanoscale CMOS technology manufacturing... 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